Texas Instruments has introduced the MSPM0C1104, which it describes as the world's smallest microcontroller, expanding its MSPM0 MCU portfolio. Measuring only 1.38mm², this wafer chip-scale package MCU is 38% smaller than existing alternatives. It is designed for applications where board space is limited, such as medical wearables and personal electronics, while maintaining functionality. The MSPM0C1104 includes a 24MHz Arm Cortex-M0+…
I’m a few months late, but I actually recommend people try to solder these at home at a hobbyist.
Below a certain size, you rely upon surface tension of the solder to “pull” the components into place. Its a combination of solder-mask (by your PCB-manufacturer) + well calibrated PCB Software + proper heating technique (hotplate and/or oven).
You’ll be surprised how “far” lead will pull your components into the correct spot. In fact, the force is so powerful that smaller components can tombstone if one side melts before the other side (ex: cold joint due to more copper pour melts slightly after, causing the “hot” side to YANK the component so hard it “flips up”).
VQFN packages are “square” though, so its unlikely for them to tombstone.
I’m a few months late, but I actually recommend people try to solder these at home at a hobbyist.
Below a certain size, you rely upon surface tension of the solder to “pull” the components into place. Its a combination of solder-mask (by your PCB-manufacturer) + well calibrated PCB Software + proper heating technique (hotplate and/or oven).
You’ll be surprised how “far” lead will pull your components into the correct spot. In fact, the force is so powerful that smaller components can tombstone if one side melts before the other side (ex: cold joint due to more copper pour melts slightly after, causing the “hot” side to YANK the component so hard it “flips up”).
VQFN packages are “square” though, so its unlikely for them to tombstone.